Microsoft envisions a thermal cooling system for its future foldable devices in a new patent

Reading time icon 2 min. read


Readers help support MSpoweruser. We may get a commission if you buy through our links. Tooltip Icon

Read our disclosure page to find out how can you help MSPoweruser sustain the editorial team Read more

If everything goes as planned, there is a strong possibility that we will see Microsoft showcasing its foldable dual-screen device at the October 2 hardware event. However, it’s said that the dual-screen device won’t go up for sale this year.

Like other manufacturers who are currently in the process of developing a foldable device, Microsoft realizes that foldable technology has a way to go and, therefore, the Redmond giant trying hard to bring innovation to its future foldable devices.

In a new patent titled ‘DEVICE CONFIGURATION-BASED THERMAL MANAGEMENT CONTROL’, Microsoft envisions a thermal management control system for its dual-screen hardware to offer thermal cooling technology.

The patent talks about a sensor that will be installed into two portions of the display. This sensor will measure the temperature.

A first sensor measures a first temperature at a first location within or on the electronic device continuously or intermittently. A second sensor measures a second temperature at a second location within or on the electronic device continuously or intermittently. A processor identifies a first state of the electronic device or a second state of the electronic device. The processor controls operation of the electronic device based on the first measured temperature and the second measured temperature when the electronic device is in the identified first state and controls the operation of the electronic device based on the first measured temperatures but not based on the second measured temperatures when the electronic device is in the identified second state.

What do our readers think about this unique solution to counter heating issues? Let us know your thoughts in the comments below.

via: Windowslatest

More about the topics: colling system, foldable device, patent, thermal cooling

Leave a Reply

Your email address will not be published. Required fields are marked *