HTC has been hard at work on their patent portfolio, and their latest application is a departure from their usual software innovations.
HTC has in fact applied for 2 patents, the first for manufacturing an electret material, which is a dia-electric material that have static apposing electrical charges and can be used to replace the diaphragm in a loudspeaker, and by being much thinner allow even sleeker smartphones.
The second patent is for an actual implementation in a phone, with various designs proposed.
These new hardware patents are an interesting departure for HTC, but possibly necessary given the squeeze they are experiencing on the software side.
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