Microsoft today revealed a new revolutionary dual-screen Surface device named Surface Neo. The Surface Neo device will be powered by an unique Intel processor code-named “Lakefield.” Lakefield mobile processor combines a hybrid CPU with Intel’s Foveros 3D packaging technology allowing OEMs like Microsoft to design new thin-and-light form factors. This new processor is built on latest 10nm process and Foveros advanced packaging technology, so it achieves a significant reduction in standby power, core area (12x12x1 mm) and package height when compared to previous generations of technology.
Lakefield hybrid CPU architecture combines “Tremont” cores with a performance scalable “Sunny Cove” core to deliver computing performance and next-generation graphics at low power for long battery life.
“The innovation we’ve achieved with Lakefield gives our industry partners the ability to deliver on new experiences, and Microsoft’s Neo is trailblazing a new category of devices. Intel is committed to pushing the boundaries of computing by delivering key technology innovations for partners across the ecosystem,” said Gregory Bryant, Intel executive vice president and general manager of the Client Computing Group.
Intel and Surface team collaborated closely to design the Surface Neo that enables new experiences without compromising on performance, design and the full Windows experience.