Qualcomm’s successor to the Snapdragon 845 processor, the Snapdragon 8150, has not been officially announced yet but leaked benchmarks have already shown it is the most powerful Android SoC solution yet.
Now Qualcomm China has confirmed that they will be announcing their next generation chipset on the 4th December this year at its upcoming Technology Summit in Hawaii.
The Qualcomm Snapdragon 8150 is expected to come with three-cluster CPU core design, similar to Kirin 980 and Exynos 9820. It will feature one large performance core running at a clock speed of 2.84GHz, three medium cores clocked at 2.4GHz, and four small efficiency cores clocked at 1.78GHz. The chipset is expected to be manufactured using the newest 7nm process by TSMC and the die size is going to be 12.4 x 12.4mm.
Unfortunately, Snapdragon 8150 can’t beat A12 which sits at the top of the benchmark table but managed to beat every other Android SoC in the market with a score of 362,292 points.
Like the Snapdragon 845, it is likely to show up in the majority new Android flagship of 2019, with the first devices expected to hit the market early next year.