Huawei has launched the world’s first 5G-integrated chipset, the HiSilicon Kirin 990 SoC at IFA 2019 in Berlin, as we predicted earlier.
Comparing the new chip with the previous model, Kirin 980, the new Kirin 990 features an upgraded GPU and NPU(Neural Processing Unit), which ensures better performance. Aside from being better than than the Kirin 980, latest 5G-integrated chip from Huawei delivers 10% higher single-core and 9% higher multi-core performance than the Snapdragon 855. It’s also 26% smaller than Qualcomm’s Snapdragon 855 and 36% smaller than Samsung’s Exynos 9820. Also, the 7nm Kirin 990 is the world’s first chip to have more than 10.3 billion transistors.
Even though the latest Kirin processor comes with integrated-5G, it will be as power-efficient as the last-gen Kirin 980 chipset, thanks to the enhanced AI algorithm.
You will also be able to render real-time videos based on the new Real-Time Multi-Instance Segmentation with ease. Recording 8K HDR videos at 30fps is another welcome addition to the latest Huawei chip. The chip will be equally good for photographers as it has Block Match 3D filtering(BM3D) algorithm, which will offer DSLR-level image noise reduction.
To deal with Bluetooth connectivity, ultra-low-power applications, and audio decoding, the Kirin 990 will be relying on the new Kirin A1 co-processor. It’s also worth mentioning that there is also a 4G variant of the Kirin 990 processor.