Qualcomm today announced three new Snapdragon processors aimed at supporting improved user experiences and connectivity for high performance and high volume mobile devices. The new Snapdragon 653, Snapdragon 626 and Snapdragon 427 processors support Qualcomm Quick Charge 3.0 technology which delivers power up to 4X faster compared to traditional charging methods. Also, dual cameras are now supported in the Snapdragon 600 and 400 tiers, for clear imaging and photos across a wider variety of photo capture scenarios, to further enhance consumer experiences.
Each chipset supports the following modem features:
- X9 LTE, with Cat 7 downlink speeds up to 300Mbps, and Cat 13 uplink speeds up to 150Mbps, designed to provide users with a 50 percent increase in maximum uplink speeds over the X8 LTE modem.
- LTE Advanced Carrier Aggregation with up to 2×20 MHz in the downlink and uplink
- Support for 64-QAM in the uplink
- Superior call clarity and higher call reliability with the Enhanced Voice Services (EVS) codec on VoLTE calls.
Snapdragon 600 and Snapdragon 400 Features:
- The Snapdragon 653 processor not only features an increase in CPU and GPU performance over the Snapdragon 652, but also doubles the addressable memory (RAM) from 4GB to 8GB supporting greatly enhanced user experiences. The Snapdragon 653 is pin and software compatible with Snapdragon 650 and 652.
- The Snapdragon 626 features a CPU performance increase over the Snapdragon 625. It also features Qualcomm® TruSignal™ antenna boost, designed to improve signal reception in congested areas. The Snapdragon 626 is pin and software compatible with Snapdragon 625, and software compatible with the Snapdragon 425, 427, 430, and 435 processors.
- The Snapdragon 427 delivers a CPU and GPU performance increase over the Snapdragon 425. It is the first chipset to bring TruSignal to the Snapdragon 400 tier of processors, designed to deliver unprecedented powerful antenna tuning to this high volume line of processor solutions. The Snapdragon 427 is pin and software compatible with Snapdragon 425, 430 and 435, and software compatible with Snapdragon 625 and 626.
The Snapdragon 653 and 626 chipsets are expected to be commercially available by the end of 2016 while the Snapdragon 427 chipset is expected to be in commercial devices in early 2017.