Qualcomm Announces Its Qualcomm Snapdragon 820 Processor

Qualcomm Snapdragon 820

Qualcomm today announced their new Snapdragon 820 system-on-chip (SoC) which is a major improvement over the previous generation Snapdragon 810 SoC. Almost every major component of the system has been significantly improved in terms of performance and power consumption to help deliver the kinds of always-on, performance-demanding experiences that users want.

The Snapdragon 820 will be manufactured on 14nm FinFET technology and includes:

New smartphones powered by Snapdragon 820 will be coming to market next year. Microsoft’s upcoming Lumia 950 and Lumia 950 XL devices are powered by Snapdragon 808 and Snapdragon 810 SoCs.

Full Specs:

CPU

Up to 2.2 GHz quad-core (Quad-core custom 64-bit Qualcomm® Kryo™)

GPU

Qualcomm® Adreno™ 530 GPU

Up to OpenGL ES 3.1+

DSP

Qualcomm® Hexagon™ 680 DSP

Camera

Up to 28 MP

Qualcomm® Spectra™ Image Sensor Processor (14-bit dual-ISP)

Video

Up to 4K Ultra HD capture and playback

H.264 (AVC)

H.265 (HEVC)

Display

4K Ultra HD on-device

4K Ultra HD output

1080p and 4K external display support

Charging

Qualcomm® Quick Charge™ 3.0

LTE Connectivity

Snapdragon X12 LTE with Global Mode

LTE Cat 12/13 (up to 600 Mbps DL 150 Mbps UL)

Up to 600 Mbps, 256-QAM DL

Up to 150 Mbps UL, 64-QAM UL

Carrier Aggregation

3x20MHz DL, 2X20MHz UL

Global Mode

  • LTE FDD and TDD
  • WCDMA (DB-DC-HSDPA, DC-HSUPA)
  • TD-SCDMA
  • EV-DO and CDMA 1x
  • GSM/EDGE

Additional features include:

  • LTE/Wi-FI link aggregation
  • LTE-U
  • LTE Broadcast
  • LTE Dual SIM, Dual Active (DSDA)
  • HD Voice over 3G and VoLTE
  • Wi-Fi calling with LTE call continuity

Wi-Fi

Qualcomm® VIVE™ 802.11ac

2×2 MU-MIMO

Tri-band Wi-Fi

RF

Qualcomm® RF360™ front end solution

Location

Qualcomm® IZat™ Gen8C

Security

Qualcomm® Haven™ Security Suite:

  • Qualcomm® SecureMSM™ hardware and software
  • Snapdragon StudioAccess™ Content Protection
  • Qualcomm® SafeSwitch™ theft prevention solution
  • Qualcomm® Snapdragon Sense™ ID 3D fingerprint technology
  • Qualcomm® Snapdragon™ Smart Protect

Storage

UFS 2.0

eMMC 5.1

SD 3.0 (UHS-I)

Memory

LPDDR4 1866MHz dual-channel

Process Technology

14 nm

USB

USB 3.0/2.0

Bluetooth

Bluetooth 4.1

NFC

Supported

Part Number

8996

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