Component leak confirms an important Samsung Galaxy S9 feature

The Samsung Galaxy S9 will be the flagship Android phone of 2018 and will find its way into the pockets of many of our readers, particularly because Microsoft sells them.

Samsung has a tendency to be a people pleaser and packs their phones with exactly what they hope the majority would like to have, and thankfully this still includes support for a real 3.5mm headphone jack (unlike Google, Apple and few more other companies).

A new component leak for the SM-G965F (via Slashleaks), which is believed to the Samsung Galaxy S9, confirms the presence of the round hole at the bottom of the device.

That rounds out a package which is expected to include a Snapdragon 845 processor, 6 GB of RAM and a dual-camera on the larger version of the device.

The device is currently expected to be unveiled at Mobile World Congress 2018 in February 2018.

Read more of our coverage of the Samsung Galaxy S9 here.

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